High-speed inspection(co) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

High-speed inspection Product List

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High-speed inspection of touch panels and touch sensors! 'OSC-301'

High-speed inspection of 120 channels for open/short below 100 msec/ch! Open/short checker with capacitive type sensor!

"OSC-301" is a testing device designed to quickly detect disconnections and shorts between the terminals of a capacitive touch panel before implementing control ICs. It flows a small current through the terminals and measures it with an internal resistance and capacitance measurement circuit to determine pass or fail. Equipped with LAN and USB interfaces for external control, as well as automatic/manual operation switching functions, it can be used for a wide range of applications from research and development to automatic testing on production lines. 【Features】 ■ Automatic/manual inspection mode switching ■ Built-in resistance and capacitance measurement circuit ■ Compatible with large panels ■ Saves inspection conditions for up to 10 models ■ External control via LAN and USB 【Application Examples】 ■ Open/short checks inside semiconductor ICs ■ Contact checks for FPDs (organic EL and LCD displays) *For more details, please feel free to contact us at the information below. Tel. 0942-41-2101 HP: https://www.mecc-jp.com/ee/contact

Company：メック電子機器事業
Price：Other

Circuit Board Inspection Equipment
High-speed inspection

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CA20 - Submicron 3D X-ray for Advanced Packaging

Designed to provide excellent 2D and 3D images at the highest resolution! Capable of inspecting micron-sized details at high speed! *Exhibited at NEPCON Japan.

The semiconductor sector is an industry that demands speed. In the competition for technological innovation, every day counts. As an inspection system specifically developed to address the challenges of complex 3D ICs in Advanced Packaging, the CA20 helps customers maintain their pace and stay at the forefront of competition. The CA20 enables accelerated validation of new packaging process node prototypes. The faster you identify and resolve the root causes of issues during ramp-up, the sooner you can achieve the desired yield and, consequently, return on investment (ROI). 【Features】 ■ Designed for the semiconductor industry ■ Non-destructive technology that captures solder bumps in three dimensions within minutes ■ High reproducibility results from reliable and accurate technology designed to support stable inspection routines ■ Efficient software-assisted review including automatic void analysis with Void Insights ■ Dose Manager to protect components sensitive to X-ray exposure *For more details, please download the PDF or feel free to contact us.